AT&T Classic Mail Design Package 1.6 Manual de usuario descargar pdf (Pagina 43)

Equipment Physical Design Standards ATT-TP-76200, Issue 19

AT&T Services, Inc. June 2014

12. Physical Design and Manufacturing Requirements

Physical Design and Manufacturing

A. Vendor shall comply with the hazardous substances provisions contained in AT&T

contract managed by procurement.

B. Equipment intended for use by AT&T outside of the United States shall meet

Restriction of Hazardous Substances Sstandards that are applicable for use within the

country it is deployed.

C. It is an objective that equipment manufacturing complies to Telcordia GR-78-CORE.

PB-free Solder Joint Reliability

This section is intended to identify Solder Joint Reliability (SJR) requirements for equipment

manufactured with PB solder per ATIS-0600019 and ATIS-0600020 standards. These

standards apply to electrical and electronics products, including, but not limited to

telecommunications equipment, sold to AT&T.

Manufacturer shall complete Pb-Free Solder Declaration (PbF Form) paragraph 15.16, and

forward to AT&T.

Per Telcordia Notice to the Industry, November 2006, Reliability Concerns with the use of

Lead (Pb) Free Solder in Telecommunications Products and other sources there is

continuing concern regarding the use of RoHS 6 compliant equipment for

telecommunications applications that require long life and high reliability. RoHS compliant

equipment and equipment components proposed for deployment in AT&T network shall

need to demonstrate reliability of solder joints equal to or greater than that of RoHS 5

equipment.

Demonstration of reliability shall include:

1. Pb free sub-assembly modules (e.g., hard drives, PCI cards, transceivers, etc.) shall

demonstrate compliance to ATIS standard Test Requirements for Pb-Free

Subassembly Modules ATIS-0600019.

Vendor shall complete and return the checklist contained in Section 4.3 of the

ATIS document.

Note: Pb-free SFP/XFP type modules are considered compliant to requirement and do

not need to be submitted for review.

2. Pb free assemblies (e.g., circuit boards, etc.) shall demonstrate compliance to the

ANSI standard Guideline for Pb-Free Assembly Qualification and Test Requirements for

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AT&T Classic Mail Design Package 1.6 Manual de usuario Pagina 43